liquid encapsulant materials
technical information
encapsulation materials department plastic materials business unit electronic materials business division
this is one component epoxy for flip-chip underfilling.
properties
unit
data
test method
viscosity(25oc)
pa*s
20
kes-b-0102
gelation time
sec
800
eks-b-1051
temperature of substrate : 80～120oc
temperature of syringe : r.t.～ 60oc
stored compound must be thawed before use. warm at room temperature until no longer cool to touch (about 2hrs).
please use up the material within 12 hrs.
compound must be stored in the cool condition with sealing.
please keep material under -40oc after receiving product.
please avoid direct contact with this product by wearing gloves, protecting gears,etc.
prevent frequent skin contact. if contact occurs, wash immediately with soap&water.
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